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| Semiconductor Supply Chain in China |
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Semiconductor Supply Chain in China
$2995
目录
· Executive Summary
· Methodology
· China Semiconductor Industry Overview
o Government Policies
o China Semiconductor Market
o China’s Role in the Global Semiconductor Industry
· Semiconductor Value Chain in China
o IC Design
§ Design Capability
§ EDA Tools and IP Usage Status
§ Foundry Tape Out Status
§ Drivers
§ Barriers
o Foundry
§ Foundry Map
§ Foundry Capacity
§ China’s Leading Foundries
§ Relationship with IC Design Companies
§ Drivers
§ Barriers
o Test & Packaging
§ Investment Status
§ Production Capacity
§ Drivers
§ Barriers
o China IDM Status
§ Top Ten International IDMs in China
§ Local IDMs
· Forecast
o Opportunities and Challenges
o Market Forecast
o China IC Industry Revenue Forecast.
§ IC Design Industry Forecast
§ Foundry Industry Forecast
§ Test & Packaging Industry Forecast
· Profiles
o Top Ten International IDMs in China
§ Intel
§ Samsung
§ TI
§ Infineon
§ Toshiba
§ Philips
§ Hynix
§ STMicroelectronics
§ Freescale
§ AMD
o Local IDMs
§ Shanghai Belling
§ Hangzhou Silan Microelectronics Co. Ltd
§ Nanker Group
§ Wu’Xi China Resources Huajing Micro Electronics Co. Ltd
o Top IC Design Companies
§ DMT
§ Actions Semiconductor
§ HED
§ Spreadtrum
§ Vimicro
o Top Foundry Firms
§ SMIC
§ GSMC
§ HHNEC
§ HeJian
§ ASMC
o Top Test & Packaging Facilities
§ NanTong Fujitsu
§ RF Micro
§ Jiangsu Changjiang Electronics Technology Co. Ltd
List of Tables
· Table 1. China Semiconductor Market Breakdown, 2002–2004 (US$ in Billions)
· Table 2. China’s Top Ten IC Design Companies, 2004
· Table 3. Worldwide Costs of Building a Fab, 1983–2003 (US$ in Millions)
· Table 4. China’s Foundry Firms Capacity, Current and Planned for 2006
· Table 5. China’s Top Ten Foundry Firms, 2004
· Table 6. China’s Top Ten Test & Packaging Facilities, 2004
· Table 7. China’s Major Digital TV Chip Vendors, 2005
· Table 8. China Semiconductor Market Forecast, 2005–2009 (US$ in Billions)
· Table 9. China IC Industry Forecast, By Sector, 2005–2009
List of Figures
· Figure 1. China’s Main Governmental Policies towards Semiconductor Industry (Since 1980)
· Figure 2. Driving the Development of Technology
· Figure 3. Semiconductor Market Share Breakdown: China vs. Global, 2004
· Figure 4. China Semiconductor Industry Structure
· Figure 5. China Semiconductor Supply Chain
· Figure 6. China IC Industry Revenue Structure, 2002–2004 (US$ in Millions)
· Figure 7. China’s IC Design Companies Geographical Distribution, 2005
· Figure 8. 2005 Annual Revenue for China’s IC Design Companies
· Figure 9. R&D Engineering Numbers for IC Design Companies, 2005
· Figure 10. China’s IC Design Companies Application Areas, 2005
· Figure 11. China’s IC Design Companies Design Proficiency, 2005
· Figure 12. China’s IC Design Companies Design Scale (Number of Logic Gates), 2005
· Figure 13. Difficulties in EDA Tool Deployment, 2005
· Figure 14. China’s IC Design Companies EDA Tools Selection, 2005
· Figure 15. IP Usage Status of China’s IC Design Companies, 2005
· Figure 16. IP Expenditure in Total R&D Cost, 2005
· Figure 17. Source and Type of Third-Party IP Acquired by IC Design Companies, 2005
· Figure 18. Foundry Selection by Country, 2005
· Figure 19. Difficulties Facing China’s IC Design Companies, 2005
· Figure 20. Numbers of Fabs in Operation in China, 2004
· Figure 21. Foundry Selection of IC Design Companies in 2005
· Figure 22. Geographical Distribution of China’s Test & Packaging Companies, 2005
· Figure 23. Source of Capital for China’s Test & Packaging Companies, 2005
· Figure 24. Investments into China’s Test & Packaging Companies (US$ in Millions)
· Figure 25. Production Capacity of China’s Test & Packaging Companies, 2005
· Figure 26. SMIC Fab Construction Status, 2004–2005
· Figure 27. GSMC Logic Technology Roadmap, 2003–2006
· Figure 28. GSMC Flash Memory & Embedded Flash Technology Roadmap, 2003–2006
· Figure 29. Process Technology Roadmap of HHNEC, pre-2004–2007
· Figure 30. HeJian’s Technology Roadmap, 2004–2007报告简介
The driving government force in China’s semiconductor industry is gradually being surpassed by market demand: China’s domestic semiconductor demand will increase at a CAGR of 21.0% y-o-y growth in 2005–2009. Due to the greatly improved desktop PC and notebook production capability of Chinese companies, computers are still the largest semiconductor application area with a share of 39.5% in China’s IC market, even though it lags behind the global market share. Market share of semiconductors for consumer electronics remains high and is 13% higher than the global market. Vast demand will continue in this sector in the next few years.
In the communications field, the proposed issuing of 3G licenses will bring new opportunities in the telecommunications sector. Short-distance wireless technologies like ZigBee, UWB, and Bluetooth2.0 will see space for development. The implementation of Digital Home is another sector that will boost consumer electronics and the wireless market.
In China’s semiconductor value chain, China’s top ten IC design companies received 45.2% of China’s total IC design industry revenue in 2004. Traditionally, test and packaging revenue accounted for over 70% of the total semiconductor industry revenue. However, as new international level foundries like SMIC and GSMC build up, semiconductor manufacturing is gradually becoming the main force behind China’s semiconductor industry.
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